Printing of micro-fine Structures

For technical applications such as the production of etch resist masks for printed circuits the generation of micro-fine structures on substrates having particular electric properties, of interest. Although offset printing regarding detail resolution and generation of ink areas with higher optical density and evenness is very efficient, difficulties arise beyond the usual visibility conditions. The printed areas are not pore-free, the outlines are slightly blurred, the printed ink layers sometimes do not adhere sufficiently on the substrate. According to practical test results the practicability of pore-free printing and good adhesion will be shown.